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Pilot Subsidy Scheme for Third-party Logistics Service Providers (TPLSP)
Future Innovative Logistics Acceleration Scheme (FILAS)

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Background

To develop Hong Kong into an international smart logistics hub, the Government of the Hong Kong Special Administrative Region (the Government) launched the “Future Innovative Logistics Acceleration Scheme” (FILAS) on 1 June 2026 under the “Pilot Subsidy Scheme for Third-party Logistics Service Providers” (the Pilot Scheme) to subsidise third-party logistics service providers (3PLs) for subscribing to or using IT onboarding solutions compatible with logistics data platforms operated by the Government or public organisations, including the Port Community System (PCS) and HKIA Cargo Data Platform (HKIA Cargo).

3PLs may only apply for subsidy for subscribing to or using eligible solutions on the White List of FILAS.  It is expected that the White List and the guidelines for application for FILAS will be announced around August 2026.

As the first stage, FILAS is now open to White List applications, with the deadline for submission of the first batch of applications set at 30 June 2026.  Solution Providers are invited to submit proposals for the inclusion of relevant IT onboarding solutions in the White List.

The approval quotas for the first batch of White List applications will be capped at three solutions.  However, the Transport and Logistics Bureau is under no obligation to use all quotas, and only solutions that meet the eligibility requirements and pass the assessment will be approved for inclusion in the White List.  Subject to fulfillment of the eligibility requirements and successful completion of the three-tier assessment mechanism, applications will be considered on a first-come, first-served basis.

For details, please refer to “FILAS - Invitation for Proposal for Onboarding IT Solutions (English only)” and “FILAS – Application Form for Solution Providers (English only)”.

For any enquiries on the above, please email to the Hong Kong Productivity Council (HKPC), the Secretariat of FILAS, at tplsp_sec@hkpc.org or call (852) 2788 6077.