Info seminar to gain maximum HK$250,000 funding support, Patent Application Grant (PAG) X HKU

Only available in English version 

Date: 24 May 2024 (Friday)

Time:  4PM – 5PM

Location: LG1/F – KKLG103, K.K. Leung Building, Main Campus of The University of Hong Kong

Speaker: Miss YIP Wing Lam, Cody (葉頴霖小姐), Associate Principal Consultant (助理首席顧問)

立即報名 (英文版本)