2024年5月24日
Info seminar to gain maximum HK$250,000 funding support, Patent Application Grant (PAG) X HKU
Only available in English version
Date: 24 May 2024 (Friday)
Time: 4PM – 5PM
Location: LG1/F – KKLG103, K.K. Leung Building, Main Campus of The University of Hong Kong
Speaker: Miss YIP Wing Lam, Cody (葉頴霖小姐), Associate Principal Consultant (助理首席顧問)
