Business of IP Asia Forum 2022
The Patent Application Grant (PAG) is a funding scheme to assist local companies and individuals to capitalise their intellectual work through patent registration.
The maximum funding support is HK$250,000 or 90% of the sum of the total direct costs of patent application (whichever is the lower).
PAG debuting at Business of IP Asia Forum 2022
On 1 to 2 December 2022, we were exhibiting at the Business of IP Asia Forum for the first time at Hong Kong Convention and Exhibition Centre.
There was an introductory seminar of PAG funding scheme on 1 December afternoon. Our team also offered priority 1-1 free consultation from 2pm to 5pm at our booth (Hall 5F - C06) on the same day. Feel free to make a reservation by emailing [email protected].
Details of Patent Application Grant (PAG) at HKTDC Business of IP Asia Forum
Date: 1 December 2022 (Physical and online)
2 December 2022 (Online)
Venue: Hong Kong Convention and Exhibition Centre, 1 Expo Drive, Wan Chai, Hong Kong
Booth: Hall 5F - C06
Seminar - The PAG government funding support (Hybrid)
Date: 1 December 2022
Time: 15:45 - 16:05
Speaker: Patricia Fong, Head, IP Management, Hong Kong Productivity Council
Venue: The stage at IP Market, Hall 5FG
BIP Asia Forum
