The BUD Fund Seminar Easy BUD Form – Filling Tips for Exhibition Measure

The Dedicated Fund on Branding, Upgrading and Domestic Sales (BUD Fund) is to provide funding support for Hong Kong enterprises in exploring and developing in Chinese Mainland and specific overseas markets through developing brands, upgrading and restructuring their operations and promoting domestic sales. To further support SMEs, enhancement measures were introduced on 15 June 2026. The SME Export Marketing Fund (EMF) was consolidated into the BUD Fund from 1 July 2026, enterprises can participate in exhibitions outside Hong Kong and export marketing activities through the BUD Fund - Easy BUD for market expansion. In addition, targeted funding support will be provided for AI-related measures, assisting enterprises in enhancing their competitiveness.

As the implementer, HKPC will conduct a seminar to cover ‘Easy BUD’ eligibility and application procedures, form‑filling guidance, exhibition and AI application case studies, and provide on‑site one‑to‑one consultation to support your application.

Highlights:
🎯 Application eligibility, procedures, and notes for form-filling
🤖 Funding support for AI-related measures and AI application case studies
💡 Strategies & tips for filling the online application form
🤝 Free one-on-one consultation
🌟 On-site account opening support

Register now! Get a head start for business funding!

Date: 22 October 2026 (Thursday)
Time: 15:00 - 17:00
Venue: Inno Network, 1/F, HKPC Building, 78 Tat Chee Avenue, Kowloon
Language: Cantonese
Inquiry: The BUD Fund | +852 2788 6088 | bud_sec@hkpc.org