[Register Now!!] Info seminar to gain maximum HK$250,000 funding support, Patent Application Grant (PAG) X HKU
HKU TEC is collaborating with the program to assist HKU members in benefiting from the scheme. On May 24, 2024, we invited Miss Cody Yip, Associate Principal Consultant of HKPC to our campus to conduct a seminar for more information. The topic is "Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection". Join us for this exclusive event where we'll explore the crucial aspects of patent protection to help you unlock innovation and secure your intellectual property rights.
Seminar 1: Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection
Date: 24 May 2024 (Friday)
Time: 4PM – 5PM
Location: LG1/F – KKLG103, K.K. Leung Building, Main Campus of The University of Hong Kong
Speaker: Miss YIP Wing Lam, Cody (葉頴霖小姐), Associate Principal Consultant (助理首席顧問)
More Info: https://tec.hku.hk/event/pag/
